Additive Manufacturing Technologies (AMT)
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AMT-equipment at TU Wien

We are focusing on developing materials and systems for lithography-based AMT processes. Currently we have the following systems installed in our labs.

Two-photon polymerization (2PP)

Technical specification

2PP  structuring device based on 800nm femto-second Laser.

  • Build envelope 40x40x60mm.
  • Minimum resolution in xy-plane: 200nm
  • Minimum resolution in z-plane: 200nm

Manufacturer: Laserzentrum Hannover


Producing three-dimensional “nano” scale structures out of a photosensitive resin, having feature resolutions down to 200 nm is not science fiction any more. The Two Photon Process (TPA) even makes it possible to write inside a given volume. In contrast to other lithography-based SFF processes it is not necessary to build a part by stacking up individual layers. Using this new technique the benefits of real 3D-structuring can be used.

Two-photon polymerization (2PP) setup based on a Galvanoscanner

Technical specification

2PP structuring device based on 800nm femto-second Laser and a Galvanoscanner.

  • Build envelope 20x20x25mm.
  • Minimum resolution in xy-plane: 200nm
  • Minimum resolution in z-plane: 700nm

Manufacturer: TU-Wien, AMT

Hot Lithography printer

The Hot Lithography printer is designed to process filled or unfilled, highly viscous resins, which cannot be processed in commercial SLA machines. This is possible by heating up the process chamber and thereby reducing the viscosity of the resin. The processing temperature can reach up to 120°C. Such highly viscous and sticky raw materials are necessary to develop tough photopolymers with a high dimensional stability at high temperatures.


The printer is located in the laboratory of the Pilotfabrik (Seestadtstraße 27, 1220 Wien) as a part of the 3D printing center.


Technical specification

• Build envelope 200x100x250mm. (x y z)

• Lateral accuracy: 10 µm

• Layer thickness: 10 to 100 µm

• Laser engine: 405 nm, 300 mW

• Spot diameter 25 µm


Hybrid AM

As the name suggests,the system provides a hybrid approach, combining lithography based AM with inkjet pocesses. It includes two different industrial inkjet systems which were implemented to increase the functionality and print multi material parts.

The building platform can rotate between a SLA-station (DLP-based exposure in a vat containg photopolymer) and an inkjet station, where an inkjet printhead selectively places ink droplets in between the cured layers (see figure).

The system has a circular vat and can be heated up to 80 °C. Filled and unfilled, viscous slurries and resins can be processed. The printer is located in the Lehartrakt laboratory at Getreidemarkt.



Technical specification SLA

• Build envelope: 70x40x120 mm (x y z)

• Lateral accuracy: 50 µm

• Layer thickness: 20 to 100 µm

• DLP Light Engine: 365 nm


Technical specification Inkjet

• Resolution: 360 dpi, 48 µm nozzle size

• Ink viscosity: 10 – 20 mPas

• Ink surface tension: 30 mN/m

• Ink supply: recirculating


BP8: the hybrid system

Blueprinter 8 (BO8) is a hybrid system with an exposure configuration. A projected mask is combined with a vector-based laser system via a dichroic beam-splitter. A Digital Light Processing (DLP®) Light Engine (LE) facilitates the mask-projection unit, whereas a 2D laser-scanner hatches a focused laser throughout the image plane. The goal is to combine the benefits of both exposure units. The DLP® LE projects a rather coarse (pixel size 56 μm) image onto the image plane. This allows us to rapidly generate a desired cross-section (layer). In contrast to this exposure approach, a laser allows a smooth surface since the laser is guided continuously by the scanner and shapes the contours with a continuous laser exposed line. The dual exposure combines both units, whereby just the contour is formed out by the laser and the remaining area is exposed by the DLP® LE. (detailed information: B. Busetti et al.; A hybrid exposure concept for lithography-based additive manufacturing, Additive Manufacturing, 21, 2018)



Technical specification

• Build envelope 140 x 90 x 155 mm (x y z)

• Layer thickness: 25 to 100 µm

• Laser diode module: 405 nm, 166 mW

• Spot diameter: 20 µm

• DLP engine: 450 nm, 20 mW/cm²

• DLP pixel size: 56µm

Confocal laser scanning microscope

The LSM 800 is a confocal laser scanning microscope from Zeiss based on an inverted Observer Z1. The inverted configuration is designed for imaging both live cells and fixed samples. The device available at IMST is equipped with an incubator for temperature and CO2 control. It is able to run multidimensional experiments including multichannel acquisition, z-stacks, tile scanning, and time-lapse. Our LSM800 is equipped with 4 laser lines, as well as detectors for both fluorescence signals and transmitted light DIC. For specialized experiments an Airyscan GaAsP detector can be used in order to improve the spatial resolution and signal to noise ratio.


Technical specification

• Detectors: Two GaASP detectors, Airyscan

• Laser Lines: 405, 488, 561, 633 nm.

• Objectives: 2,5x, 10x, 40x (water)


Contact Prof. Aleksandr Ovsianikov regarding conditions of use and service fee



Atomic Force Microscope

The ATOMIC FORCE MICROSCOPE XE7 from Parks has all the state-of-the-art technology and yet, simple equipment used for the study of morphological, topographical, electrical, magnetic, nanomechanical properties of the materials. The flat, orthogonal, and linear scan measurements, as well as the unique design of XE7, which includes separate XY and Z scanners, assist in the obtaining high resolution sample images and the characteristic measurements true to its nanostructure.


XE7 is located at the main building of TU Vienna in the Interfacultary Laboratory for Micro- and Nanomechanics of Biological and Biomimetical Materials.


Technical specification

• XY Scanner: Single-module flexure XY scanner with closed-loop control

• Z Scanner: Guided high-force Z scanner

• Sample Diameter: Up to 100 mm

• Thickness: Up to 20 mm

• AFM Modes: True Non-Contact AFM, Basic Contact AFM, Lateral Force Microscopy (LFM), Phase Imaging and Intermittent (tapping) AFM